• PERFECTRON launches new EBX SBC OXY5739A, powered by Intel® 6th Gen. Skylake-H® Xeon®/Core™ i7 processors, 32GB DDR IV, SSD soldering on board
    Stackable with StackPC & FPE Expansion, Extended Temperature - 40°C to 85°C


Taipei, Taiwan, August, 30, 2017 –
PERFECTRON, an innovative industrial computing and embedded system solution provider, has launched a new EBX SBC – OXY5739A. The OXY5739A based on Intel® QM170 chipset, is powered by Intel® 6th generation Skylake-H® Xeon®/Core™i7 processor onboard.

OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85℃ to ensure ultimate durability, utmost resistance toshock & vibration. OXY5739A is truly a rugged SBC ideal for defense, military, high-end Automation and heavy-duty railway applications.

More key functions are featuring in the stacking PCIe/104 expansion ability, flexible I/O functions for triple display ports (2 x DP, LVDS, DVI-D), SATA 3.0 SSD soldering on board and 12V DC-in power support.
 
 
Thermal solution for fanless system design
 
PERFECTRON, expert of truly extended temperature range solution, provide customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreader are used to transfer heat from heat generating point to heat sink and heat sink are used to cool down device's temperature by dissipating heat into surrounding air. In order to reach best heat dissipation, PERFECTRON customize heat spreader in order to make sure the perfect conduction with key components. Special design heat sink then could have best heat dissipation due to wave line on the interface which increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost, OXY5739A ensures high reliability and stability while working under wide range temperature from -40 up to 85°C.
 
Critical components soldering onboard
 
To achieve high standard of shock and vibration demand, OXY5739A EBX SBC was designed with components soldering onboard including CPU, NANO SATA 3.0 SSD and Swissbit XR-DIMM. This not only enhances the conductivity for circuit dissipation but also improves the robustness of motherboards. Benefits of soldering:
  • High density
  • Heat conduction
  • Maximum Resistance to Shock and Vibration
  • Lower resistance and inductance at the connection
  • Better and more predictable high-frequency performance
  • High EMC compatibility (lower radiated emissions) and the smaller lead inductance
 
 
Rich I/O for flexibility in I/O configurations
 
OXY5739A embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP and DVI-D display connectivity ports with dual channel 24-bit LVDS. OXY5739 reserve also various expansion flexibility, PCIe/104 (StackPC) + FPE for Stackable PCIe/104 module expansion; 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe, moreover, with CM236 chipset, the SBC support 1 x 2280 M.2 (M-Key) for compact and rugged storage option. This feature-rich board also includes four COM ports, eight USB ports, two Gigabit LANs, two SATAIII, all these can help system integrators to develop solutions quickly.
 
Stackable with PCIe/104 & FPE expansion
 
Known for application's ruggedness, reliability, sealing properties, and compactness characteristics, PCIe/104 & FPE connectors are ideal for high-end electronic equipment used in extreme environmental conditions. Our rugged connectors have a functional life greater than 10,000 mating cycles, with easy connect/disconnect and blind mating. The PCIe/104 standard specifies Samtec's Q2™ QMS/QFS Series in a three bank (156-pin) orientation for module stacking. Samtec specifically designed the QMS/QFS Series with a 15.24 mm stack height for top and bottom board stacking. Q2™ has triple the wipe of many high speed mezzanine interconnects making it appropriate for rugged applications.
 
Extended temperature support -40°C to 85°C
 
OXY5739A is a model born for extreme temperature environments by proven outstanding operation performance under crucial conditions. Powered by Intel® 6th Gen. Skylake-H® Xeon®/Core™ i7 processors, it survives an extended market-leading operating temperature range of -40°C to 85°C without processor throttling (reduced frequency) and continuously presents superior high performance.
 
Stunning resistance of shock and vibration
 
OXY5739A has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also storage onboard with rugged XR-DIMM RAM option which drastically enhances the resistance of vibration and shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by adding on extra cards. The cable-free operation remove the concern about loosen cable connections caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, OXY5739A is perfect solution for critical application and harsh environment.
 
Main Features:

  • Intel® 6th Gen. Skylake-H® Xeon®/Core™ i7 processors on board
  • Stackable Expansions : 1 x PCIe_16 (FPE), 4 x PCIe_1 (PCIe/104)
  • 1x Swissbit XR-DIMM + 1 x SODIMM up to 32 GB RAM
  • Onboard nano SATA 3.0 SSD up to 64 GB
  • Multi-Displays by 2 x DP, 1 x DVI-D, 1 x Dual Channel 24-bit LVDS
  • 2 x mPCIe + 1 x M.2 (2280) Expansion slot
  • 2 x Intel® Gigabit Ethernet
  • 4 x USB 3.0, 4 x USB 2.0, 4 x COM , 2 x SATA III
  • +9V~36V DC-In with power delay on/off
  • Extended Temperature -40 to 85°C