• OXY5335A
  • 3.5" SBC, Intel® Ivy Bridge Core i7/i5/i3 CPU onboard, Extended Temperature. -40 to 85°C
  • •Intel® Ivy Bridge BGA CPU + Intel QM77 PCH
  • •Multi display: VGA, DVI-I, LVDS
  • •4 COM, 10 USB, 2 LAN
  • •2 SATAIII and HD Audio
  • •1 x Full-size miniPCIe and 1 x mSATA
  • •Onboard SIM Card slot for 3.5G connectivity
  • •Extended operating temperature. -40 to 85°C
The OXY5335A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

 

  • Test Result
 Device Model  OXY5335A  Test Result  Pass
 Tester  Ian Huang
 Diagram of curves  Test Temperature  Test Time
 High  0~85°C  5Hours
 Low  -40~0°C  2Hours
 Test Standard  Reference IEC60068-2
 Test Software  Burnin test v6.0
 Criteria  After testing, system can’t halt.
  • Test Configuration
 Device  Configuration  Manufacturer  Part Number
 CPU Type  Intel® Core™ i7-3517UE Processor (4M Cache, up to 2.80 GHz)  Intel  i7-3517UE
 PCH  Mobile Intel® QM77 Express Chipset  Intel  QM77
 Memory  Innodisk 8GB DDR3 1600W/T SODIMM  Innodisk  M3S0-4GSSCLPC
 port2 SATA III  Innodisk 256G SATA III SSD    
 port3 SATA II  Apacer SATA III 128GB mSATA    
 USB1、USB2  Passmark Loopback Plugs for USB 3.0    
 LAN1  Intel® 82574L GbE  Intel  82574L
 LAN2  Intel® 82579LM GbE  Intel  82579L
 Test Software  Burnin test v6.0、HD Tune v4.01、iperf、Passmark
 USB3.0
   
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3

 

 

  • Thermal Measurement
  • PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5335A-ET-i7-4700EQ for one hour, from +50 to +85°C.