• OXY5737A
  • Intel® QM87 EBX SBC, Core i7/i5/i3 CPU Haswell & SSD Soldering Onboard, Stackable with StackPC & FPE Expansion, Extended Temperature - 40°C to 85°C
  • •Intel® Haswell BGA CPU + Intel QM87 PCH
  • •Stackable expansions: 1 x PCIe_16 (FPE), 4 x PCIe_1 (PCIe/104)
  • •Onboard XR-DIMM up to 8GB
  • •Onboard μSSD, compliant with JEDEC MO-276
  • •Onboard Resistive Touch Controller
  • •Multi displays: 2 x DP, DVI-I, LVDS
  • •Rich I/O: 6 COM, 6 USB, 2 LAN, 2 SATAIII
  • •Flexible expansion with 2 x Full-size miniPCIe (one co-lay with mSATA)
  • •Onboard SIM Card slot for 3.5G connectivity
  • •Extended operating temperature. -40 to 85°C
  • Introduction
  • OXY5737A, a powerful rugged EBX SBC is driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4GHz, up to 3.4GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. OXY5737A is regarded as a greedy SBC that highly integrates ample I/O on one board to cater various applications usage. Mission-critical applications can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5737A is truly a rugged SBC ideal for defense, aviation, high-end Automation and heavy-duty railway applications.

 

  • Thermal solution for fanless system design
  • Heat sinks are used to cool down device temperature by dissipating heat into surrounding air. PERFECTRON designs tailor-made heat sink for each motherboard. Special high and low fin design forms a wind-flow to reduce thermal resistance. Moreover, cross section wave line on the interface increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost. OXY5737A has the special design of two budges that are tailor-made based on the heat sources placement of CPU and PCH. With customized heat sink, OXY5737A ensures high reliability and stability while working under wide range temperature from -40 up to 85°C

 

  • Rich I/O for flexibility in I/O configurations
  • OXY5737A embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP and DVI-I display connectivity ports with dual channel 24-bit LVDS. The outstanding embedded board supports stackable expansion of 1 x PCIe_16 (FPE), 4 x PCIe_1 (PCIe/104) which enable a cable-free board to build an extreme rugged and compact system with more expansion flexibility. This feature-rich board also includes four RS232, two RS232/422/485, six USB ports, two Gigabit LANs, two SATAIII, all these can help system integrators to develop solutions quickly. Viewing the popularity of 3G and touch panel usage, OXY5737A carries onboard SIM Card slot for 3.5G connectivity and onboard Pen Mount 6000 resistive touch controller for connecting touch panel.

 

  • Stunning resistance of shock and vibration
  • OXY5737A has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also memory and storage onboard which drastically enhance the resistance of vibration and shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by adding on extra cards. The cable-free operation remove the concern about loosen cable connections caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, it is also compliant to MIL-STD 810G standard, can withstand 5g vibration, 100g single shocks and 50g multiple shocks.

 

  • Installation Instruction
  • Procedure: Stick thermal pad on CPU and chipset, and then simply put passive heat sink on thermal pad.
  • Aluminum specially design with two budges on the bottom which are used to contact with CPU and chipset directly to absorb heat efficiently from the bottom layer, and then spread the collected heat to upper aluminum heat sink. Aluminum is known as well heat convection regarding to its metal characteristic. After transferring heat from bottom layer to heat sink, High and low fin design plus wave line create airflow to dissipate heat.

 

  • Copper Heat Spreader
    The copper heat spreader directly touches heat sources from OXY5737A. •99.9 % purity of copper, weighs 81.9 g and consumes 79.71 cm •23.4 mm height to fulfill the gap between OXY5737A and heat sink enclosure •Nickel plated to prevent corrosion and rust after long-term use •Tailor-made two bulges on heat spreader correspond to the placement of CPU and chipset on OXY5737A.

Aluminum Passive Heat Sink

  • Heat sink is known for lowering the temperature by dissipating heat into the surrounding air.
    •It contains 96 % of aluminum, 31 mm height and weighs 381 g
    •Tailor-made two bulges on the bottom of heat sink correspond to the placement of CPU and
    PCH on OXY5737A
    •High and low fin design plus wave line increase contact surface up to 30-40% and create airflow.
  • •Consume shorter heat dissipating time owing to lower metal density
  • •Better performance in heat dissipating


Operating Temp.
Can with stand extended temperature from -40 to 85°C