• OXY5739A
  • Intel® 6th Gen. Skylake-H® Xeon®/Core™ i7 processors & SSD soldering on board, Stackable with StackPC & FPE Expansion, Extended Temperature - 40°C to 85°C
  • • Support Intel® Skylake-H Xeon® E3-1505L v5 Processor
  • • Support Intel® Skylake-H Core™ i7-6820EQ/i7-6822EQ Processor
  • • Apacer/Smart uSSD 64GB (SATA III)
  • • 1 x XR-DIMM, 1 x SO-DIMM up to DDR4-2400 32GB
  • • 1 x M.2 (M-Key), 2 x Mini PCIe
  • • Multi display: 2 x DisplayPort; 1 x DVI-D; Dual Channel 24 Bit LVDS
  • • Dual LAN Ports (1 x Intel I210-IT & 1 x I219-LM GbE)
  • • 8 x USB ports: 4 x USB 3.0, 4 x USB 2.0
  • • Extended operating temp. -40~+85°C
  • Introduction
  • OXY5739A, a powerful rugged EBX SBC is driven by Intel® 6th generation Skylake CPU and chipset soldering onboard. Processor i7-6820EQ plus Intel® QM170 chipset supports clock speed up to 3.5GHz. Quad cores, turbo up to 8 cores, the SBC with high computing power for multi-tasking while reducing idle power consumption. In order to cater various application usages, OXY5739A integrates ample I/O on one board, and also reserve expansion possibility for easy system integration. For mission-critical applications, OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5739A is truly a rugged SBC ideal for defense, military, high-end Automation and heavy-duty railway applications.

 

  • Thermal solution for fanless system design
  • PERFECTRON, expert of truly extended temperature range solution, provide customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreader are used to transfer heat from heat generating point to heat sink and heat sink are used to cool down device’s temperature by dissipating heat into surrounding air. In order to reach best heat dissipation, PERFECTRON customize heat spreader in order to make sure the perfect conduction with key components. Special design heat sink then could have best heat dissipation due to wave line on the interface which increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost, OXY5739A ensures high reliability and stability while working under wide range temperature from -40 up to 85°C

 

  • Rich I/O for flexibility in I/O configurations
  • OXY5739A embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP and DVI-D display connectivity ports with dual channel 24-bit LVDS. OXY5739 reserve also various expansion flexibility, PCIe/104 (StackPC) + FPE for Stackable PCIe/104 module expansion; 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe, moreover, with CM236 chipset, the SBC support 1 x 2280 M.2 (M-Key) for compact and rugged storage option. This feature-rich board also includes four COM ports, eight USB ports, two Gigabit LANs, two SATAIII, all these can help system integrators to develop solutions quickly.

 

  • Stunning resistance of shock and vibration
  • OXY5739A has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also storage onboard with rugged XR-DIMM RAM option which drastically enhances the resistance of vibration and shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by adding on extra cards. The cable-free operation remove the concern about loosen cable connections caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, OXY5739A is perfect solution for critical application and harsh environment.

 

  • Installation Instruction
  • Procedure: Stick thermal pad on CPU and chipset, and then simply put passive heat sink on thermal pad.
  • Aluminum specially design with two budges on the bottom which are used to contact with CPU and chipset directly to absorb heat efficiently from the bottom layer, and then spread the collected heat to upper aluminum heat sink. Aluminum is known as well heat convection regarding to its metal characteristic. After transferring heat from bottom layer to heat sink, High and low fin design plus wave line create airflow to dissipate heat.

 

  • Copper Heat Spreader
    The copper heat spreader directly touches heat sources from OXY5739A. •99.9 % purity of copper, weighs 68 g and consumes 87 mm •36 mm height to fulfill the gap between OXY5739A and heat sink enclosure •Nickel plated to prevent corrosion and rust after long-term use •Tailor-made two bulges on heat spreader correspond to the placement of CPU and chipset on OXY5739A

Aluminum Passive Heat Sink

  • Heat sink is known for lowering the temperature by dissipating heat into the surrounding air.
    •It contains 96 % of aluminum, 40 mm height and weighs 135 g
    •Tailor-made two bulges on the bottom of heat sink correspond to the placement of CPU and PCH on OXY5739A
    •High and low fin design plus wave line increase contact surface up to 30-40% and create airflow.
    •Consume shorter heat dissipating time owing to lower metal density
    •Better performance in heat dissipating
  • •Consume shorter heat dissipating time owing to lower metal density
  • •Better performance in heat dissipating


Operating Temp.
Can with stand extended temperature from -40 to 85°C