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OXY5315A_Intel Atom N455, -40°C to 85°C, 12V DC Input

3.5" SBC Intel® Pineview N455 CPU with DDR3 SO-DIMM, Dual Display by VGA/LVDS, Dual GbE LAN, Audio, 8 x COM, 8 x USB, and 12V DC-in -40°C to 85°C

  • Intel® Atom Pineview N455 onboard + Intel ICH8M PCH
  • Dual independent display: VGA, LVDS
  • Rich I/O interface with 8 COM, 8 USB, 2 LAN, 2 SATAII, and 1 x Compact Flash Typell Socket
  • Flexible expansion with 1 x miniPCIe
  • Support Single/dual Channel 18-bit LVDS
  • 12V DC-in, 4-pin ATX power connector, AT/ATX mode support
  • Extended operating temperature. -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance


OXY5315A is a 3.5” industrial motherboard, driven by Intel® Atom Pineview N455 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview N455 plus Intel ICH8M chipset is only 6.5W and 2.4W respectively. The overall power consumption is as low as 8.9W! It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40°C to 85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; optional single/dual channel 18-bit/24-bit LVDS. With such extensive functions and powerful computing ability, OXY5315A can fulfill diverse needs of modern day display & monitor control applications.

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Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5315A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5315A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5315A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5315A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.

Installation Instruction

Procedure: Place the thermal pad on top of the CPU, and then stick the heat sink upwards.

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Thermal Pad
Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.

  • To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.
  • The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.
  • With precise calculation, the thermal pad we implemented is 3mm in height.

Heat Sink
Heat sink is known for improving the distribution of heat. Our tailor-made heat spreader is made with and aluminum. It can dissipate the heat in the quickest fashion.

  • It contains 96% of aluminum, 48mm height and weighs 15g.
  • Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.
  • Dissipate heat quicker than copper owing to lower heat conductivity efficiency. (Copper: 402; Aluminum: 266)
  • Excellent performance in heat dissipation.

Operating Temp.
Can withstand extended temperature from -40°C to 85°C – board level


Operating Temp.


UT : -40°C to 85°C





Intel® Atom™ N455 1.66 GHz


Intel® 82801HBM ICH8 Mobile (ICH8M)

Memory Type

1 x 204-pin SO-DIMM DDR3 800 MHz up to 2 GB



Super I/O


2nd Super I/O

Fintek F81216AD


1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot


Mini PCIe

1 x miniPCIe for Gen2




Integrated Intel® GMA3150 Graphic core

Onboard VGA

Yes (Max. resolution 1400 x 1050 @ 60 Hz)


Supports single channel 18-bit LVDS (Max. resolution 1366 x 768)

Dual Independent
Displays Capability





Realtek ALC662 High Definition Audio Codec *2W amplifier onboard




2 x RTL8111DL GbE LAN (support 10/100/1000 Mbps for 2 x RJ45 ports)



Boot from LAN

Yes for PXE

Rear I/O



1 x 15-pin VGA connector (female)


2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports)


1 x RS-232/422/485 with 5V/12V selectable


Serial Signals


RS422: TX-, RX+, TX+, RX-, GND,



2 x USB 2.0

Reset Button


Internal I/O



2 x SATAII (3 Gb/s)

CF card

1 x CF socket by IDE interface


6 x USB 2.0 ports by 2 x 5-pin header


7 x COM ports

COM2~COM4 ports support RS232 only with 5V/12V selectable by 1 x 10-pin header
COM5~8 port support RS232 by 1 x 10-pin header


2 x 3-pin header for Mic-in/Line-in/Line-out
2 x 2-pin header for right and left Speaker-out


20-pin connector


2 x 3-pin header

Parallel Port

2 x 13-pin header


8-bit (4 in/4 out)

OS support list



Windows 7 x32Windows 7 x64


Open SUSE 12.2Debian 7.0.0

Mechanical and Environment


Form Factor

3.5" SBC

Power Type

12V DC-in, 4-pin ATX power connector, AT/ATX mode support


146 x 102 mm (5.7" x 4")

Operating Temp.

UT : -40°C to 85°C

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing





Temperature Shock

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)

High Temperature

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )

Low Temperature

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

 Device Model  OXY5315A  Test Result  Pass
 Tester  Ian Huang
 Diagram of curves  Test Temperature  Test Time
5315  High  0°C to 85°C  5Hours
 Low  -40°C to 0°C  2Hours
 Test Standard  Reference IEC60068-2
 Test Software  Burnin test v6.0
 Criteria  After testing, system can’t halt.


Test Configuration

 Device  Configuration  Manufacturer  Part Number
 CPU Type  Intel® Atom™ N455 1.66GHz(6.5W)  Intel  N455
 PCH  Intel® 8280 1HBM ICH8 Mobile  Intel  ICH8
 Memory  Innodisk 2GB DDR3 1333 W/T SODIMM  Innodisk  
 port2 SATAIII  Innodisk 128GB SATA SSD    
 LAN1  Realtek RTL8111E GbE LAN  Realtek  RTL8111E
 LAN2  Realtek RTL8111E GbE LAN  Realtek  RTL8111E
 Test Software  Burnin test v7.1、HD Tune v4.01、iperf、Passmark USB2.0
 Intel TAT,CPU Z-1.67
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3


Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5315A for one hour, from 50°C to 85°C.

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