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3.5" SBC Intel® Apollo Lake Atom / Celeron /Pentium BGA processor, 1 x DDR3L SO-DIMM, 6 x USB, 4 x COM, 8~24V DC-IN, -20 to 70°C, -40 to 85°C (Optional)

  • Intel® Apollo Lake Atom / Celeron /Pentium BGA processor
  • 1 x DDR3L SO-DIMM and support up to 8GB
  • Support triple display for HDMI, VGA and LVDS / eDP
  • 1 x Mini PCIe + 1 x M.2 slot
  • 2 x SATAIII (1 x SATA is multiplexed with 1 x mSATA port)
  • 2 x Intel® Gigabit Ethernet
  • 2 x USB 2.0, 4 x USB 3.0 and 4 x COM
  • 8~24V wide voltage power input
  • mPCIe with SIM card holder
  • Technical Profile
  • Specifications
  • Certification

OXY5323A is a highly integrated 3.5" rugged SBC driven by Intel® Apollo Lake Processor. It features rich I/O interface, such as: 4 COM Ports; 2 LAN Ports6 USB Ports. Support triple display for HDMI, VGA and LVDS / eDP, OXY5323A can fulfill diverse needs of modern day display & monitor control applications. Moreover, OXY5323A can avoid damage from sudden surge of voltage with its 8V to 24V wide range DC input design.

Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5323A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 4 COM, 6 USB, 2 LAN, and triple display for HDMI, VGA and LVDS / eDP, OXY5323A provides a wide array of choices to expand and connect to different devices.






Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5323A can operate from  -20°C to 70°C , our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

A tailor-made heat spreader is what PERFECTRON provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5323A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.




Intel® Apollo Lake-M N3350/N4200 Processor
Intel® Apollo Lake-I E3930 Processor

Memory type

DDR3L 1866MHz, 1 x 204-pin SO-DIMM, Max. 8GB (Non-ECC)


Intel® SoC Integrated


Intel® HD Graphics


2 x Intel® I210-IT Giga LAN


Realtek® ALC662

I/O Chipset

Nuvoton NCT6116D


Nuvoton NPCT650ABCYX TPM2.0 (Optional)

Expansion Slot

Storage: Mini PCIe Full size (USB / PCIe / SATA), w/ SIM Card Holder

Wireless: M.2 2230 E-key (PCIe / USB)



H / W Monitor

Temperature Monitor, Voltage Monitor

Watchdog Timer

1 to 255 Steps by Software Program

Smart Fan Control




Up to 1920 x 1200 @60 Hz


Up to 4K (3840 x 2160) @30 Hz


Up to 1920 x 1200 @60 Hz

eDP (Option)

Up to 4K (3840 x 2160) @60 Hz

Rear I/O


4 x USB 3.0

Display I/O

1 x HDMI 1.4, 1 x VGA


2 x RJ-45

Internal Connectors
Storage 2 x SATAIII ( 1 x SATA is multiplexed with 1 x mSATA port)
USB 2 x USB 2.0
Display I/O

1 x LVDS, 1 x eDP

1 x Backlight Connector

Audio I/O 1 x Audio Header (Front Panel Mic-in & Line-out)
Serial Port 4 x RS232 (One Supports RS232/422/485)
GPIO 1 x MiAPI Header (Programmable. Support 10bit GPIO)
Fan 1 x 4-pin CPU Fan Header
Power 1 x 8~24V ATX Power Connector, 1 x AT/ATX Mode Select Jumper
Others 1 x CMOS Jumper
Power Requirement
Power Input 8~24V Wide Range DC Input w/4-pin ATX connector (Pitch: 4.2mm)
Operating Temperature

-20 to 70°C (Optional -40 to 85℃) 

Storage Temperature -40 to 85°C 
Operating Humidity 10% to 95% R/H, non-condensing
Standard Compliance
Standard Compliance CE/FCC
OS Support

Windows® 10 64-bit

  Linux(Support by request)