Skip to main content


9th Gen. Intel® Xeon®, Core™ i7 EBX SBC with PCIe/104 Rugged Extreme Temperature -40°C to 85°C

  • 9th / 8th Gen Intel® Xeon® / Core™ processor with up to 6 Intel® Xeon® E-2276ME / E-2276ML / Core™ i7-9850HE / i7-9850HL / i5-8400H
  • PCIe/104 stackable bus structure(Type 2)
  • FPE connector ( 1*PCIe x16 or 2*PCIe x8 or 1*PCIe x8+2*PCIe x4)
  • 4x DDR4-2666MHz SO-DIMM, up to 128GB, ECC for Xeon® SKU
  • Multi display” Triple simultaneous displays with 48-bit LVDS+DP
  • 1x M.2 2280 M-key, 2x Full size mPCIe, 1x PCIe/104, 1x FPE
  • Dual GbE, 4x SATA III, 2x RS232/422/485
  • 6x USB3.0, 4x USB2.0
  • Extended operating temp. -40°C to 85°C

Intel Gold

  • Technical Profile
  • Specifications
  • Order Information
  • Video



PERFECTRON, the leading pioneer in ruggedised and embedded systems, introduces the latest EBX SBC OXY5741B. The EBX SBC measures 243*146 mm, providing extraordinary computing performance under extreme environment. It is powered by 9th / 8th Gen Intel® Xeon® / Core ™. Featuring Intel’s Xeon E-2276ME and ruggedised open-standard EBX architecture, PERFECTRON EBX series is built tentatively and triumphs on environmental testing. It still operates effectively under harsh environments ranging from -40°C to 85°C so that it is a perfect solution for defence, transportation, and automation applications. More key functions such as stackable PCIe/104 expansion ability, flexible I/O, and NVMe Gen 3.0 PCIex4 for fast and large capacity storage, all contribute to this versatile architecture that can meet clients’ needs.

OXY5741A Banner橫式_0.jpg

PCIe104 Xeon SBC

Key Features
  • 9th / 8th Gen Intel® Xeon® / Core ™ processor with up to 6 cores and 45W/25W TDP
  • EBX SBC Dedicates PCIe/104 Type 2
  • Dual channel DDR4-2666MHz with up to 128GB *, ECC for Xeon SKU
  • Three simultaneous displays with 48 bit LVDS + HDMI + DP
  • USB 3.0, TPM 2.0 and NVMe / PCIe Gen3x4 SSD
  • Dual GbE, SATA III, RS-232/422/485
  • M.2 M-Key 2280 and Full size mPCIe(one support SIM card)
What is Small Form Factor (S.F.F)?

Top View

Small form factor computer is the crucial component that drives the entire system operation as they can fit into smaller spaces and consume less power. They can be packaged and mounted in diverse ways than larger boards. The reduction of size, weight, and cost (SWaP) has been continuously emphasised as more computer systems demand smaller processor and network connectivity solutions. As a result, application such as automation and transportation which demand more differently stackable ways often employ small form factors architecture.


DDR4 2666 128GB Optimised Performance

Since speed and power matters most in computing performance, OXY5741B is built in 4 x SO-DIMMs up to 128GB to deliver optimisation of the performance. Adding DDR4-128GB not only maximises CPU and computing performance, but also enables more robust and responsive virtual machines and applications. Taking advantage from the cutting edge DRAM technology, OXY5741B EBX XEON SBC can optimise system performance by accelerating the memory capacities of servers.

Ruggedised Open Standard PCIe/104 Facilitate Flexible Expansion

Choosing an embedded architecture for computer systems can be a formidable task. This kind of stackable and mezzanine architecture often results in tradeoffs that include off-the-shelf or custom design requirements. PCIe/104 compact, ruggedised, easily expandable traits support a lot of expansion flexibility in systems. This architecture evolved to address these resulting issues by keeping the common background while eliminating limitations. OXY5741B employs PCIe/104 technology to reduce constraints and create flexibility of expansion. Its M.2 extension offers M-key 2280, and PCIe 3.0 x 4 NVMe. Additionally, OXY5741B provides 3.0 ports for data redundancy by supporting RAID 0/1.

Screenshot 2021-01-22 155333.png
High Performance and Fast Storage

Today, ruggedised systems or computers are expected to possess speedy and smooth response times. In light of making these systems render high performance, NVMe protocol delivers a high-bandwidth and low-latency user experience. Moreover, via accessing a PCIe bus that supports a huge number of parallel command queues, NVMe can effortlessly access flash storage. This platform incorporates Intel® Xeon E-2276ME with 4 cores. OXY5741B supports up to 128GB of dual-channel DDR4 2400MHz memory and features an M.2 M-Key 2280 slot for NVMe / PCIE Gen3x4 high-speed PCIe SSD storage, thus offering extremely high data speeds for processing. The above features make OXY5741B an outstanding solution for applications that demand high performance in a EBX form factor. 

Board Placement

Top placement

Back placement



Intel® Core™ i7-9850HE Processor

(6 Cores/12 Threads, 9M Cache, up to 4.40 GHz), 45W

Intel® Core i7-9850HL Processor

(6 Cores/12 Threads, 9M Cache, up to 4.10 GHz), 25W

XEON® E-2276ME Processor

(6 Cores/12 Threads, 12M Cache, up to 4.50 GHz), 45W

XEON® E-2276ML Processor

(6 Cores/12 Threads, 12M Cache, up to 4.20 GHz), 25W

Intel® Core™ i5-8400H Processor

(6 Cores/12 Threads, 8M Cache, up to 4.20 GHz), 45W

Memory type

4x DDR4 2666MHz 260 Pin SO-DIMM

(up to 128GB, Xeon® Sku Support ECC)





BIOS Flash

SPI Flash

Super I/O

ITE 8786


TPM 2.0 (SLB9665)


iAMT 12.0


1-255 sec. or 1-255 min. software programmable and can be generate system reset


Display Port

Resolution up to 4096 x 2304 @ 60Hz


Intel® UHD Graphics 630


Triple simultaneous display with LVDS + 2x Mini-DP


1* Dual Channel 24-bit LVDS, max resolution up to 1920 x 1080 @60Hz (w/auto-dimming support)





Expansion Slot


1x M.2 (M-key, type:2280, SATA/PCIe 3.0 x4 NVMe)


2x Full size (USB/PCIe and 1x Micro SIM Card)




1x FPE slot.



Intel® I210 & I219LM GbE LAN (10/100/1000 Mbps supported )



Boot from LAN

Yes for PXE

Rear I/O


Display Port

2*mini-DIP Display Port Female 20P 90D

Internal I/O header (No Edge I/O Needed)


4x SATAIII (RAID 0,1,5) , from 2 up to 4 ports

SATA power


LVDS connector

1x (30 pins) or equal ---> W/Auto-dimming supports), Bright light control

LVDS Inverter

1x (10 pins) box header

8 bit GPIO

1x (4in/4out) in a (10 pins) box header


2x RS232/422/485 (2x 10 pins) box header

SIM card holder

1x (Micro SIM) in mini-PCIe slot


2x 10/100/1000 Base (20 x 1.0 wire to Board connector)

USB 3.0

4x USB3.0 (2x 20GU 2.0 x 2.0mm box header)


4x USB2.0(2x5 Pins) box header


1x LPC (10 pins ) box header

Front Panel

1 (2x 5 pins) Power BTN/HDD LED/Reset BTN/PWR LED/Buzzer

Smart Fan

1x CPU Fan --->1x 4 pins for CPU(PWM mode)


1x MIC-IN / LINE OUT (10 pins) box header


1x RTC battery holder

Power DC-IN

1x (4 x 2pin) horizontal type

Mechanical and Environmental

Form Factor



146mm x 243mm

Power Type


Power Consumption


Operation Temperature

-40℃ ~ 85℃(ambient with air flow)

Storage Temperature

-40℃ ~ 85℃

Relative humidity

10% to 90%, non-condensing

Standard Compliance

Standard Compliance



OS Support

Windows® 10 64-bit

Linux (Support by request)


Model Description
OXY5741B-01UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor  7 I7-9850HE(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-02UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I7-9850HL(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-03UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ME(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-04UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor E-2276ML(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
OXY5741B-05UT EBX Industrial Motherboard Intel Intel® 14nm Coffee Lake-H Processor I5-8400H(Embedded) BGA(FCBGA1440) with 4 x DDR4 SO-DIMM, Dual Intel® GbE LAN, PCIe/104 Type2 & FPE, 12V (-40°C ~ 85°C)
Cable kit

Cable Kit list