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INS8320B

INS8320B_Intel® Cedarview N2600, 9V-24V, -40°C to 85°C

Mini ITX form factor, Intel® Cedarview N2600 CPU on board, Extended Temperature. -40°C to 85°C

  • Intel® Cedarview N2600 CPU + Intel® NM10
  • Single/Dual channel 18/24-bit LVDS
  • Rich I/O interface with 10 COM, 7 USB, 2 LAN
  • Flexible expansion with 1 x mPCIe
  • 16bit DIO (8 in/8 out)
  • 9-24V wide voltage DC-in design
  • Extended operating temperature. -40°C to 85°C
  • Technical Profile
  • Specifications
Introduction

INS8320B is a Mini-ITX form factor industrial motherboard, designed with Intel® Cedarview N2600 CPU soldered onboard. Processor N2600 supports dual core 1.6 GHz, presenting only 3.5 W extremely low power consumption with high performance. With processor soldered onboard can significantly enhance the resistance of vibration and shock. Extensive I/O interface with 10 COM ports and 16 bit DIO can increase a variety of possibility for device connect ability. Extended temperature operation from -40 to +85°C ensures unbeatable reliability and wide range DC-in 9 ~24V design can protect the board from damages caused by sudden surge of voltage. INS8320B is rugged SBC and expected to be a good solution for automation and transportation industry.

                                                                        Mini ITX IMB_INS8320B_02

Thermal solution for fanless system– the incorporation of two pure copper heat pipes and aluminum heat sink

Thermal design is the solution for the maximum reduction of heat. With upper passive aluminum heat sink and cooled aluminum enclosure is implemented to create an effective dissipation environment. With two pure high efficiency copper heat pipes plus aluminum heat sink to ensure maximum thermal efficiency. Copper vacuum Heat-Pipe has effective thermal conductivities that range from 5,000 W/m•K to 200,000 W/m•K to effectively transfer heat from the heat source to the heat sink. This advanced thermal solution enables system to operate smoothly under temperature range -40 to 80°C -without processor throttling.

Effective cooling solution for maximum heat dissipation

Perfectron implements unique cooling solution with the copper heat spreader and aluminum heat sink. To adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, heat is then transferred to upper aluminum heat sink; the aluminum heat sink dissipates the heat into surrounding air promptly. The heat sink design with high and low shape to create temperature difference then produce airflow, the wave lines on the lateral side of heat sink can increase the dissipating interface up to 30 to 40%. Through above unique design could achieve maximum heat dissipation.

Installation Instruction

 

 

Procedure:

Stick thermal pad on CPU and chipset, and then place passive heat sink on thermal pad.

 

Mini ITX IMB_INS8320B_03

               Mini ITX IMB_INS8320B_04

 

 

1.Thermal Pad
Thermal pad is aid the conduction of heat away from the component being cooled (such as CPU or chip) and into the heat sink.

  • The unit of Heat Transfer Coefficient for thermal pad is W/m.K. The higher the Heat Transfer Coefficient number is, the better thermal conductivity for thermal pad could reach. PERFECTRON adopts thermal pad with 17 W/m.K which is military standard level that can guarantee the maximum thermal conductivity between components and heat sink

 

 

 

 

 

2.Copper & Aluminum Passive Heat Spreader
Heat sink is known for lowering the temperature by dissipating heat into the surrounding air. PERFECTRON implements aluminum heat sink instead of copper because aluminum can dissipate the heat more rapidly than copper due to metal characteristic

  • It contains 96 % of aluminum, 127 mm length, 48 mm height, and weighs 315 g
  • Consume shorter heat dissipating time owing to lower metal density
  • Better performance in heat dissipating

 

 

 

 

 

 

Operating Temp.

Can withstand extended temperature from -40 to 85°C

 

 

 

Operating Temp.

 

-40°C to 85°C

 

System

 

CPU Type

Intel® Atom™ N2600 1.6GHz onboard

Chipset

Intel® NM10 Express Chipset (Intel® CG82NM10 PCH)

Memory Type

1 x 204-pin SO-DIMM DDR3 800/1066 MHz up to 2GB

BIOS

AMI® BIOS

Super I/O

IT8786E

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot

 

PCI slot

1

mSATA

1 x SSD storage compatible with PCIe Mini Card

Mini PCIe

1 for GEN2

Display

 

Chipset

Intel® PowerVR SGX545 Graphic core

Onboard VGA

Yes (Max. resolution 1920 x 1200 @ 60 Hz)

LVDS

Support 18/24-bits LVDS single/dual/channel

DP: 2560 x 1600 @ 60 Hz

eDP: 1920 x 1080 @ 60 Hz

Onboard DVI-D

Yes (Max. resolution 1920 x 1200 @ 60 Hz)

Dual Independent

Display Capability

VGA+DVI, VGA+LVDS, LVDS+DVI

Audio

 

Codec

Realtek ALC887

Ethernet

 

Chipset

2 x Intel® 82574L GbE LAN (support 10/100/1000 Mbps)

Disable LAN

through BIOS

Yes

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O

 

VGA

1 x 15-pin VGA connector (female)

DVI-D 

1 x 25-pin DVI-D connector (female)

Audio

Line-out, Mic-in

Ethernet

2 x RJ45

COM

1 x RS232/422/485 with 5V/12V selection (COM1)

1 x RS232 with 5V/12V selection (COM2)

 

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

4 ports with 5V

I/O Interface

 

SATA

2 x SATAII (3 Gb/s)

USB

3 ports by pin header

COM

8 x COM ports

COM3~COM10 ports support RS232 with

5V/12V selectable by pin header (COM5 port supports RS232/422/485 with 5V/12V selectable)

PS/2

2 x 4-pin header

LVDS

2 x 15-pin connector

Fan

CPU/System fan connectors

GPIO

16-bit (8 in/8 out)

Parallel Port

2 x 13-pin header

DIO

pin header (for cash drawer)

OS support list

 

Windows

Windows 7 x32Windows 7 x64

Linux

Fedora 10Fedora 14Open SUSE 12.2Debian 7.0.0

Mechanical and Environment

 

Form Factor

Mini-ITX Industrial MB

Power Type

9V to 24V DC-in

Dimension

170 x 170 mm (6.7" x 6.7" )

Operating Temp.

-40°C to 85°C

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing

Certification

 

Vibration test

IEC 60068-2-64

Random Vibration test

Frequency: 5Hz to 500Hz

Acceleration: 3.0 g rms

Test Axis: X, Y, Z axis

Test Time: 30Min (Each axis)

Shock test

IEC 60068-2-27

Shock test

Wave form: Half Sine Wave

Acceleration: 100g

Duration Time: 6ms

MIL-STD-810G

Temperature Shock:

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85 to -40, Three cycle)

 

High Temperature:

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75 non-operating + 72 hours @ 75 operating )

 

Low Temperature:

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40 non-operating +72 hours @ -40 operating )