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INS8335A

INS8335A_Intel® i7 3610QE , 9V-24V DC Input, -40°C to 85°C

Mini ITX form factor, Intel® Ivy Bridge QM77 CPU, Extended Temperature. -40°C to 85°C

  • Intel® Ivy Bridge CPU + Intel QM77 PCH
  • Multi display: VGA, DVI, LVDS, HDMI
  • Rich I/O interface with 6 COM, 8 USB, 2 LAN, 4 SATA
  • (2 SATAIII, 2 SATAII) and HD Audio
  • Flexible expansion with 1 x miniPCIe, 1 x PCIe and 1 x PCI
  • 8-bit DIO (4 in/4 out)
  • 2 x RJ45 for Ethernet connection
  • 9 – 24V wide voltage DC-in design
  • Extended operating temperature. -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • Thermal Solution
Introduction

INS8335A is a Mini-ITX form factor industrial motherboard, powered by Intel® Ivy Bridge 22nm processor and QM77 chipset. Processor i7-3610QE plus Intel® QM77 chipset consumes only 45W and 4.1W individually. It supports four-core that can turbo up to eight-core. Extreme computing power and reliability are guaranteed by this powerful combination. Clock speed can boost from 2.3 GHz to 3.3 GHz. Wide range 9V~24V DC input design can protect the board from damages caused by sudden surge of voltage, thus further secure the reliability. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 6 COM ports (3 by RS485/232/422); 8 Bit DIO; LPT; PS2. The expansion capacity of INS8335A is stunning, it supports 1 x PCI, 1 x PCI_e, and 1 x mPCI_e. With various extensive ability and strong computing power, INS8335A can be utilized in applications such as large size KIOSK, facial identification, and gaming industry.

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Turbo Boost – Full speed operation from 2.3GHz up to 3.3GHz

The powerful combination of Intel Ivy Bridge 22nm processor and QM77 chipset contributes to processor full speed operation. With turbo boost technology, the processor core can run faster than TDP configuration specified frequency, the clock speed can boost up from 2.3 GHz up to 3.3 GHz. Processor i7-3610QE features Intel® Turbo Boost Technology 2.0, which can increase dynamically the frequency with Max TDP hitting only 45W. Eight-core design brings out the best performance, fulfilling higher demands with maximum reliability and stability.

Wide Range DC-in Design

Wide input range from 9 to 24 volt creates a worry-free universality that can be used in different DC systems. INS8335A is the all-inclusive solution for flexible operation. Wide range DC-in design also protects it from damages caused by sudden fluctuation. This protection design not only reduces cost, but also provides scalability and eliminates the trouble of redesign of existing power architecture. The ability to withstand tough power cranks as well as transient over-voltage situations is thus guaranteed.

Integrated thermal solution – the incorporation of four pure copper heat pipes and a copper heat sink

INS8335A, with its dynamic 4-core 45W core i7-3610QE processor, demands an equal high level thermal solution. To achieve maximum heat dissipation, the design and implementation of heat pipes is the golden key. For board level heat dissipation, an aluminum heat sink is placed directly on top of the PCH. The passive heat exchanger is capable of dissipating heat into the surrounding medium. It’s designed to maximize its surface area in contact with the cooling medium. The heat sink is made of 96% purity of aluminum, the height is 9.9mm and it weighs 11.5g.
For system level heat dissipation, a copper heat sink and passively cooled enclosure is implemented to establish an effective dissipation environment. The structure of four pure copper heat pipes is to ensure supreme thermal efficiency. The heat pipes are capable of prompt dissipation of the heat generated by the CPU’s inner core while it’s computing. According to PERFECTRON’s testing result, each pure copper heat pipe has the ability to dissipate 9w of heat. The combination of four heat pipes pushes the dissipation ability to a new level.
Our tailor-made, precision-aimed integral structural heat sink and embedded heat pipes constitute an excellent fanless thermal solution. When the CPU hits 100% full potency, the implementation of four 6mm (minimum) pure copper heat pipes can keep it running at full speed – 2.3 GHz!

Installation Instruction

 

 

Procedure:

The thermal pad is placed directly on top of the CPU die to create a tight connection between the two. The custom made heat spreader, with four semi-circle trails precisely CNC milled, houses the four pure copper heat pipes securely. The top layer is a flat aluminum heat sink that can achieve the most effective heat dissipation solution.

 

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1.Thermal Pad

Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.

•To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.

•The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.

•With precise calculation, the thermal pad we implemented is 3mm in height.

 

2.Copper & Aluminum Passive Heat Spreader

Heat spreader is known for improving the distribution of heat. Our tailor-made heat spreader is made with copper and aluminum. Four CNC designed semi-circle trail make sure that the heat pipes can be housed securely with the heat spreader.

•The outer layer contains 96% of aluminum, the height is 23.5mm and it weighs 142g.

•The inner layer contains 99.9% of copper, the height is 23.5mm and it weighs 173g.

•Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.

•Absorb heat quicker than aluminum owing to higher heat conductivity efficiency. (Copper: 402; Aluminum: 266)

• Excellent performance in heat absorption

 

3. Copper Heat Pipe

Heat pipes are capable of transferring the heat from the source (evaporator) to the heat sink (condenser) over relatively long distances through the latent heat of vaporization of a working fluid. A typical heat pipe consists of a vessel that is first vacuumed, then charged with a working fluid and sealed hermetically. When the heat pipe is heated at one end, the working fluid evaporates from liquid to vapor (phase change). The vapor travels through the hollow core of the heat pipe to the other end at near sonic speed, where heat is being removed by the aluminum heat sinks at the sides.

•To achieve maximum heat conduction and dissipation, four pure copper heat pipes are implemented.

•The diameter of each heat pipe is 6mm..

•Each pure copper heat pipe has the ability to dissipate 9w of heat.

•Each heat pipe contains 99% of copper.

Operating Temp.

Can withstand extended temperature from -40 to 85°C – board level

 

 

Operating Temp.

 

-40°C to 85°C

 

System

 

CPU Type

Intel® 22nm Ivy Bridge Processor (Mobile) socket (rPGA988)

Intel® Core™ i7-3610QE 2.3 GHz (6M Cache, 45W)

Intel® Core™ i5-3610ME 2.7 GHz (3M Cache, 35W)

Intel® Core™ i3-3120ME 2.4 GHz (3M Cache, 35W)

Chipset

Intel® QM77 Express Chipset (Intel® BD82QM77 PCH)

Memory Type

2 x 204-pin SO-DIMM support up to 16 GB dual channel DDR3 1333/1600, Non-ECC

BIOS

AMI® UEFI BIOS

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot

 

PCIe x1

1 for PCIe x1 from PCH

PCI

1

Mini PCIe

1

Display

 

Chipset

Integrated GFX in Ivy Bridge processor

Onboard VGA

Yes, Max: SXGA 2048 x1536 @ 60 Hz

LVDS

Dual channel 24-bit LVDS, Max. 1920 x 1200

Onboard DVI-D

Yes, (Max. resolution 1920 x 1200)

Onboard HDMI

Yes, (Max. resolution 1920 x 1200)

Independent

Display Capability

VGA, LVDS, DVI-D, HDMI

Audio

 

Codec

Realtek ALC892 High Definition Audio Codec *2W amplifier

Ethernet

 

Chipset

Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps)

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O

 

VGA

1 x 15-pin VGA connector (female)

DVI-D 

1 x 25-pin DVI-D connector (female)

HDMI

1 x 19-pin HDMI A Type connector (female)

Ethernet

2 x RJ45

COM

1 x RS-232/422/485 with 5V/12V selectable

 

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND

RS485: DATA-, DATA+, GND

USB

4 x USB 3.0

DC Jack

1 x 4-pin connector (female)

I/O Interface

 

SATA

2 x SATAIII (6 Gb/s)

2 x SATAII (3 Gb/s)

Supports RAID 0,1,5,10

CF-SATA

1 x for PCIe x1

USB

4 x USB 2.0 ports by pin header

COM

5 x COM ports

COM2~3 ports RS232 with 5V/12V selectable by pin header

COM4 port supports RS232 by pin header

COM5~6 ports RS232/422/485 by pin header"

PS/2

1 x pin-header for PS/2 keyboard and mouse

LVDS

1 x 30-pin connector

Fan

1 x CPU fan

1 x System fan connector

Parallel Port

2 x 13-pin header

DIO

16-bit (8 in/8 out)

OS support list

 

Windows

Windows XP x32Windows XP x64Windows 7 x32Windows 7 x64

Linux

Open SUSE 12.2Ubuntu 12.04

Mechanical and Environment

 

Form Factor

Mini-ITX Industrial MB

Power Type

9V to 24V DC-in

Dimension

170 x 170 mm (6.7" x 6.7" )

Operating Temp.

-40 to 85°C

Relative Humidity

10% to 90%, non-condensing

Certification

 

Vibration test

IEC 60068-2-64

Random Vibration test

Frequency: 5Hz to 500Hz

Acceleration: 3.0 g rms

Test Axis: X, Y, Z axis

Test Time: 30Min (Each axis)

Shock test

IEC 60068-2-27

Shock test

Wave form: Half Sine Wave

Acceleration: 100g

Duration Time: 6ms

 

 

 

 

MIL-STD-810G

Temperature Shock:

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)

 

High Temperature:

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )

 

Low Temperature:

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

INS8335A_CPU performance_02

Test Configuration
INS8335A_CPU performance_03

 
Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in INS8335A-ET-i7-4700EQ for one hour, from +50 to +85°C.

INS8335A_CPU performance_04

 

Related System - Core i Performance Fanless System PER335A

PER335A is a system of high performance and durability. Powered by PERFECTRON’s INS8335A high performance motherboard, PER335A can thrive at +70℃ without processor throttling and continually presents superior 2.3 GHz clock speed. 8 bit DIO can meet the needs of various different applications, such as automation, medical, surveillance, transportation and military. Wide range DC input design from 9V to 24V can protect the system from sudden current fluctuation. For applications that require extreme resistance to shock and vibration, PER335A has passed IEC 60068-2-64& IEC 60068-2-27 vibration and shock tests. In an effort to permanently vanquish the malfunction due to crash and collision, PER335A is equipped with four rubber foot stands at the front side to prevent possible damages to I/O and power switch. With industrial grade handles assembled on two sides of the system, easy installation and utmost mobility are warranted.

 

INS8335A_Thermal solution_01

 

System main board: Mini-ITX SBC INS8335A

(1) Ever powerful Intel Core i7 CPU

Rugged system demands an even stronger heart to pump it through all types of tough applications. Powered intel i7 CPU, both the computing power and the rugged ability are tightly secured. With Turbo Boost Technology, the computing power is even more mighty and robust.

 

(2) Ergonomic sturdy design – Handles &Foot Stands

By placing two industrial grade, extremely reliable handles on the side, the system can be installed and moved with ease. For operations that require mobility and flexibility, the handle design helps to establish a convenient setting. Robust handles also help to form a sturdier framework. Four rubber foot stands are installed in the front to protect front I/O and power switch from collision.

(3) Comprehensive thermal design

PER335A incorporates four pure copper heat pipes and a copper & aluminum passive heat spreader. On the two sides of the system are aluminum heat sinks to push the dissipation ability to a complete new level.

 

(4) Supreme resistance to shock & vibration (IEC compliant)

The ability to withstand high level of shock and vibration is guaranteed through EC 60068-2-64& IEC 60068-2-27 vibration and shock tests.

  • Supports Intel® 22nm Ivy Bridge Processor Socket Type i7/i5/i3

  • 2 x DDR3 SO-DIMM up to 16 GB
  • Supports 2.5" SATA HDD/SSD & CF-SATA socket
  • 1 x VGA, 1 x DVI-D, 1 x HDMI
  • Dual GbE LAN ports
  • 4 x USB 3.0/ 4 x USB 2.0
  • 5 x COM ports (2 x RS232/422/485, 3 x RS232)
  • Supports wide range power input 9V~24V DC-in (By terminal block
Advanced cooling solution for better heat dissipation

To meet the demands of customer`s extended temperature requirements, the whole thermal solution of INS8335A simultaneously embraces two heat transfer methods, heat conduction and heat convection. For heat conduction, the solution utilizes a copper heat spreader on the bottom layer which directly contact with the processor and chipset. Heat is then transferred to upper aluminum heat sink. Regarding to heat convection, the temperature differences caused by high and low fin design forms a mild airflow that could bring away heat efficiently. Fan can also be an auxiliary by placing an appropriate sized fan on top of the heat sink. Breakdown drawing is provided as below.

 

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Thermal Pad
After countless experiments, PERFECTRON’s experienced engineer team has learned valuable lessons about the perfect thickness of thermal pad from failures. Precise design of thermal pad: the gap between CPU die and heat sink should be less than 1 mm.

 

Pure Copper Heat Pipe
Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

•The longer ones are 365 mm in length, 99.9% purity of copper.

•The shorter ones are 157 mm in length, 99.9% purity of copper. High heat conductivity efficiency up to 5000.

 

 

Copper & Aluminum Heat Spreader
•The outer layer contains 96% of aluminum, the height is 23.5 mm and it weighs 142g. The inner layer contains 99.9% of copper, the height is 23.5 mm and it weighs 173g.

 

Dual Sided Aluminum Heat Sink
•The heat sink each weighs 650g, and the height is 3.8cm

•The heat conducted by the heat sink will be dissipated by the aluminum heat sink placed on the two sides.

•Aluminum has higher efficiency in heat dissipation.