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INS8365B, Support  8th/ 9th Coffee Lake Intel® Core™ i9/ i7/i5/i3 LGA1151 Socket Processor

  • Support  8th/ 9th Coffee Lake Intel® Core™ i9/ i7/i5/i3 LGA1151 Socket Processor
  • Intel® Q370 Chipset
  • Intel® vPro technology support 
  • 2 x DDR4 SO-DIMM up to 64GB
  • 2 x DisplayPort, 1 x HDMI
  • 2 x RJ45 (Intel I219-LM Giga LAN + Intel I210-AT Giga LAN)
  • 4 x USB 3.1 Gen. 2 
  • 1 x M.2 M 2280, 1 x M.2 E 2230, 1 x mPCIe Full size, 1 x PCIe X16
  • DC-in 12V 
  • Operating Temperature: -20°C ~ 70°C ET, -40°C ~ 85°C UT
  • Technical Profile
  • Specifications

INS8365B, a powerful rugged Mini-ITX solution driven by Intel® 9th generation Coffee Lake-R CPU, support LGA1151 Socket Processor on TDP of 35W/65W/95W up to Octa cores. Accompanied with Intel® Q370 chipset, the IMB with high computing power is capable of multi-tasking while reducing idle power consumption, and also fulfill variety of utility applications. A wide range power input option offers users opportunity to adopt various application conditions.

Besides, INS8365B got rich I/O ports, complete and flexible expansion possibility for easy system integration. For mission-critical applications, INS8365B take advantage of key components soldered onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration.

INS8365B is truly a rugged IMB ideal for Energy/ Utility/ High performance application needs.



Main Features
  • DC Input : Main configuration is 12V DC input, and it can extend to 12~24V for wide range option.

  • Extended Temperature : Operation under -20~+70 degree, -40 degree nature boot up for mission critical applications, and harsh environment.

  • RICH Expansions : 1 x PCIe X16 slot, 1 x Mini PCIe Full size, 1 x M.2 2260 / 2280 M key, 1 x M.2 2230 E key



Operating Temp.


ET : -20°C to 70°C

UT : -40°C to 85°C




CPU Type

9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor,

Core i9-9900T (8core/35W)

Core i7-8700K (6core /95W)

Core i7-9700TE (8core/35W)

Core i5-9500TE (6core /35W)


Intel Q370 (Support RAID 0 / 1) support vPro / Intel H310

Memory Type

DDR4 2666MHz, 2 x 260-pin SO-DIMM, Max. 32GB (Non-ECC)


AMI BIOS, 256 Mbit SPI


1~255 Steps by Software

Graphics Intel HD Graphics
Ethernet Intel I219-LM Giga LAN + Intel I210-AT Giga LAN
Audio Realtek ALC662
Super I/O Nuvoton NCT6116D
TPM TPM Header (option TPM-SPI-NPCT750)
H / W Monitor Temperature Monitor, Voltage Monitor, Fan Monitor
Form Factor Mini-ITX: 6.7” x 6.7” (170mm x 170mm)

Expansion Slot


Expansion Slot

1 x PCIe X16 slot

1 x Mini PCIe Full size (SATA, USB, PCIe)

1 x M.2 2260 / 2280 M key (PCIe, SATA) * H310 only supports M.2 SATA SSD

1 x M.2 2230 E key (PCIe, USB 2.0)




Up to 4K (4096 x 2160) @30 Hz


Up to 4K (4096 x 2304) @60 Hz

2nd DisplayPort

Up to 4K (4096 x 2304) @60 Hz (Q370 ONLY)


Up to 1920 x 1200 @60 Hz

Rear I/O


Display I/O

1 x HDMI 1.4, 2 x DisplayPort 1.2

Audio I/O

1 x Mic-in ,1 x Line-out


4 x USB 3.1 Gen. 2 (10Gb/S)(Q370) / 4 x USB 3.0 (H310)


2 x RJ-45

Others 1 x DIN 4-pin DC Jack

Internal I/O





5 x USB 2.0 (Q370) , 4 x USB 2.0 (H310)

Display I/O

1 x LVDS (Optional eDP SKU available)

1 x Backlight Connector

Audio I/O

1 x Speaker 2W

Serial Port

4 x RS232 (two supports RS232/422/485 select by BIOS)


1 x MiAPI Header (Programmable)


1 x 4-pin CPU Fan Connector, 1 x 4-pin System Fan Connector

Power 1 x ATX 4-pin Power Connector, 1 x AT / ATX Mode Select Jumper
Others 1 x Front Audio Header (Mic-in / Line-out), 1 x CMOS Jumper, 1 x panel power select header, 1 x backlight power select header, 1x buzzer header

Mechanical and Environment

Power Input

DC-in 12V DIN 4-pin connector / ATX 4pin 12V

*optional 12V-24V SKU

Operating Temperature

ET : -20°C to 70°C

UT : -40°C to 85°C

Storage Temperature

-40°C to 85°C

Operating Humidity

10% ~ 95% R/H, non-condensing


CE & FCC Class B