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OXY5313A

OXY5313A_Intel Pineview D525, -40°C to 85°C, 12V DC Input

3.5" SBC Intel® Pineview D525 CPU with DDR3 SO-DIMM, Dual Display by VGA/LVDS, Dual GbE LAN, Audio, 8 x COM, 8 x USB, and 12V DC-in -40°C to 85°C

  • Supports Intel® Atom™ D525 CPU onboard
  • Single/dual channel 18/24-bit LVDS
  • 1 x Mini PCIe slot
  • 5 x COM ports
  • 7 x USB ports
  • 12V DC-in
  • Extended temp. -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution

Introduction

OXY5313A is a 3.5” industrial motherboard, driven by Intel® Atom Pineview D525 CPU onboard and ICH8M chipset. Extreme low power consumption of Processor Atom Pineview D525 plus Intel ICH8M chipset is only 13W and 2.4W respectively. Powerful dual-core operation and energy-saving low power design make OXY5313A an ideal candidate for display and automation applications. It supports AC/DC power convert function, which provides a more flexible power selection. VGA & CPU onboard design creates a higher ability to withstand vibration and shock. Extended temperature operation from -40 to +85°C ensures unbeatable reliability. Fast processor equips with rich legacy I/O features such as: 8 COM ports; 8 Bit DIO; 8 x USB; Single 18-bit LVDS. With such extensive functions and powerful computing ability, OXY5313A can fulfill diverse needs of modern day display & monitor control applications.

 

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Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5313A with the ability to comprehend present day automation, display, and other applications that require extensive I/O features. With 8 COM ports, 8 USB, 2 LAN, 2 SATAII and dual-display (VGA+LVDS), OXY5313A provides a wide array of choices to expand and connect to different devices.

 

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5313A can operate from -40 up to 85 degree, our strict manufacture procedure guarantees supreme performance in severe environment.

 

Efficient thermal solution

Thermal pad and heat sink are used to make up an effective thermal solution. For OXY5313A, the thermal pad is placed on top of the CPU, acting as a supportive medium to dissipate the heat to the surrounding atmosphere. The thermal pad is of the perfect thickness (3mm) to deliver the best performance. An aluminum heat sink is fixed on top of the thermal pad to quick the whole dissipation process.

 

Installation Instruction

Procedure: Place the thermal pad on top of the CPU, and then stick the heat sink upwards.

 

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Thermal Pad

Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.
•To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.

• The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.
•With precise calculation, the thermal pad we implemented is 3mm in height.

Heat Sink

Heat sink is known for improving the distribution of heat. Our tailor-made heat spreader is made with and aluminum. It can dissipate the heat in the quickest fashion.
•It contains 96% of aluminum, 48mm height and weighs 15g.

•Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.

•Dissipate heat quicker than copper owing to lower heat conductivity efficiency. (Copper: 402; Aluminum: 266)

•Excellent performance in heat dissipation.

Operating Temp.

Can withstand extended temperature from -40°C to 85°C – board level

 

Operating Temp.

UT : -40°C °C 85°C

System
 

CPU

Intel® Atom™ D525 1.80 GHz onboard

Chipset

Intel® 82801HBM ICH8 Mobile (ICH8M)

Memory Type

1 x 204-pin SO-DIMM DDR3 800 MHz up to 4 GB

BIOS

AMI® BIOS

Super I/O

ITE IT8781F

2nd Super I/O

Fintek F81216AD

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot
 

Mini PCIe

1 x miniPCIe for Gen2

Display
 

Chipset

Integrated Intel® GMA3150 Graphic core

Onboard VGA

Yes (Max. resolution 2048 x 1536 @ 60 Hz)

LVDS

Supports single channel 18-bit LVDS (Max. resolution 1366 x 768)

Dual Independent
Displays Capability

VGA + LVDS

Audio
 

Codec

Realtek ALC662 High Definition Audio Codec *2W amplifier onboard

Ethernet
 

Chipset

2 x RTL8111DL GbE LAN (support 10/100/1000 Mbps for 2 x RJ45 ports)

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O
 

VGA

1 x 15-pin VGA connector (female)

Ethernet

2 x RJ45 ports

COM

1 x RS-232/422/485 with 5V/12V selectable

 

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

2 x USB 2.0

Reset Button

1

Internal I/O
 

SATA

2 x SATAII (3 Gb/s)

CF card

1 x CF socket by IDE interface

USB

6 x USB 2.0 ports by 2 x 5-pin header

COM

7 x COM ports

 

COM2~COM4 ports support RS232 only with 5V/12V selectable by 1 x 10-pin header
COM5~8 port support RS232 by 1 x 10-pin header

Audio

2 x 3-pin header for Mic-in/Line-in/Line-out
2 x 2-pin header for right and left Speaker-out

LVDS

20-pin connector

PS/2

2 x 3-pin header

Parellel Port

2 x 13-pin header

DIO

8-bit (4 in/4 out)

OS support list

Windows

Windows 7 x32Windows 7 x64

Linux

Open SUSE 12.2Debian 7.0.0

Mechanical and Environment

Form Factor

3.5" SBC

Power Type

12V DC-in, 4-pin ATX power connector, AT/ATX mode support

Dimension

146 x 102 mm (5.7" x 4")

Operating Temp.

UT : -40°C to 85°C

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing

Certification

MIL-STD-810G

 

Temperature Shock

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)

High Temperature

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )

Low Temperature

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

5313

Device Model OXY5313A
Tester Ian Huang
Test Result Pass
Test Temperature(High/Time) 0~85°C/5 Hours
Test Temperature(Low/Time) -40~0°C/2 Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can’t halt.

 

 

Test Configuration

 Device  Configuration  Manufacturer  Part Number
 CPU  Intel® Atom™ D525 1.80 GHz onboard  Intel  
 PCH  Intel® 82801HBM ICH8 Mobile (ICH8M)  Intel  
 Memory  Innodisk 2GB DDR3 1333W/T SODIMM  Innodisk  
 port2 SATAII  Innodisk 256G SATA SSD  Innodisk  
 USB1、USB2  Passmark Loopback Plugs for USB 2.0    
 LAN1  Realtek 8111DL GbE

 

   
 LAN2  Realtek 8111DL GbE    
 Test Software  Burnin test v6.0、HD Tune v4.0 、iperf、Passmark
 USB2.0 Intel TAT_3.8.7.1104
   
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3

 

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5313A for one hour, from 50°C to 85°C.

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All-inclusive Thermal Solution for the best performance

The top lid of ROC315B is itself a well function heat sink. Fanless design can supply all the demands posted by high-end applications. Aluminum top lid is an effective heat sink that provides a large area for heat dissipation. The heat sink inside the system is also made of aluminum; a material fits for quick and reliable heat removal.

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Unique Tailor-made Heat Sink
The special designed heat sink function both as an effective heat sink and the top lid of ROC315B. Aluminum heat sink can dissipate the heat with maximum efficiency.

 •It contains_____of aluminum, the height is_______ and weighs _______ .

 •Due to metal property, Aluminum can dissipate heat in a quick fashion. Our fin design heat sink is capable of fast and reliable heat dissipation.

 

Aluminum Heat Sink
Heat sink is known for its ability to improve the distribution of heat. Our tailor-made heat sink is made with aluminum. It can dissipate the heat in the quickest fashion.

 •It contains 96% of aluminum, 48mm in height and weighs 103.5g.

 •Consumes shorter heat dissipating time owing to lower metal density

 • Better performance in heat dissipation

 

Power Module - SK701
Power modules provide electrical and, thermal contact, and electrical insulation where needed. SK701 is a wide input board type converter that supports input range from 9V to36V. SK701 is space-saving, thus suitable for slim fanless design. Made and tested by automatic production line, high quality and performance are guaranteed. 

 •Wide Input Range: 9V to 36V DC

 •12V DC output up to 5 Amp

 •Over voltage Protection/Over Current Protection

 •Hot swap/live insertion

 •Compact size: 100(W) x 30 (L) mm

 • Supports Extended Operating Temp. -40 to 85 degree

 

OXY5313A

3.5”system mainboard OXY5313A powers up the system with maximum computing power. With the incorporation of thermal pad & heat sink, the heat generated during computing can be dissipated timely.