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OXY5321A

OXY5321A_Intel Atom D2550, -40°C to 85°C, 12V DC-in_02
OXY5321A_Intel Atom D2550, -40°C to 85°C, 12V DC-in_01
OXY5321A_Intel Atom D2550, -40°C to 85°C, 12V DC-in_03

3.5" SBC Intel® Cedarview D2550 with DDR3 SO-DIMM, Dual Display by LVDS/DVI-I, Dual GbE LAN, Audio, 5 x COM, 7 x USB, and 12V DC-in -40°C to 85°C

  • Intel® Atom Cedarview D2550 + Intel ICH8M PCH on board
  • Dual independent display: DVI-I, LVDS
  • Rich I/O interface with 5 COM, 7 USB, 2 LAN, 2 SATAII, and 1 CFast Socket
  • Flexible expansion with 1 x mini PCIe
  • Support Single Channel 18/24-bit single/dual LVDS
  • 12V DC-in, 4-pin ATX power connector, AT/ATX mode support
  • Extended operating temperature -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance

Introduction

OXY5321A, 3.5” form factor industrial motherboard, driven by Intel® 3rd generation Atom Cedarview D2550 processor and NM10 chipset on board. The feature of OXY5321A is to provide low power consumption of only 10W and chipset of 2.1W while supporting dual-core of 1.8 GHz of CPU clock speed. This powerful dual-core operation and energy-saving low power design make OXY5321A an ideal candidate for display, automation, transportation, medical and more applications. To fulfill small form factor with versatile functions, OXY5321A supports one SATA II port and one CFast slot for storage, the maximum memory can be up to DDR3 4GB. Onboard there are up to five COM ports with 5V/12V (one RS232/422/482, four RS232), seven USB 2.0 and dual LAN by RTL8111E chip which supports wake on LAN. Apart from rich I/O for extension and system integration, PERFECTRON’s OXY5321A is design to meet rugged operating environment, from most important power, clock generator to Super I/O components, PERFECTRON only use extended operating temperature components to ensure the wide range temperature from -40°C to 85°C. And by processor and chipset soldering on board, this Cedarview 3.5”SBC can withstand high level of shock and vibration. With these two features, OXY5321A can work extra well in ruggedized missions and to perform superior stability and reliability.

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Rich I/O interface – Extensive Functionality

Rich I/O design endows OXY5321A with the ability to comprehend present day automation devices, display, and other applications that require extensive I/O features. With 5 COM ports, 7 USB, 2 LAN, 2 SATAII (one by CFast) and dual-display (DVI-I + LVDS), OXY5321A provides a wide array of choices to expand and connect to different devices.

Extended Temperature Operation

PERFECTRON aims to provide excellent performance to all types of temperature zone. From component selection to layout design, we dedicate our knowledge to make sure that our boards can stand extreme temperature. OXY5321A can operate from -40°C up to 85°C, our strict manufacture procedure guarantees supreme performance in severe environment.

Efficient thermal solution

A tailor-made heat spreader is what PERFECTRON provide for engineers to reduce mechanical design period also ensures the highest efficacy for dissipation. For OXY5321A, the customized heat sink is placed on top of the CPU and chipset, acting as the medium that exchanges the heat to the surrounding atmosphere. The highly efficient aluminum heat sink has a thermal conductivity to absorb the heat generated by the pumping CPU.

Installation Instruction

Procedure: Place the thermal pad on top of the CPU and chipset, and then stick the heat sink upwards.

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Thermal Pad
Thermal pad is widely used to aid the conduction of heat away from the component that needs to be cooled down (e.g. CPU) and into the heat sink.
•To determine the effectiveness of a thermal pad, the unit “K” is applied. Most of the other companies in the embedded market employ materials under K10 for economic reason. Perfectron, with the target of reaching CPU full speed without throttling, incorporates only K17 military grade as our principle specification.

•The thinner the thermal pad is the better effect it creates. The thickness of the thermal pad is crucial, be it too thick, the heat will cumulate and force the heat dissipated by the CPU to flow back.

•With precise calculation, the thermal pad we implemented is 3mm in height.

Heat Sink
Heat sink is known for improving the distribution of heat. Our tailor-made heat spreader is made with and aluminum. It can dissipate the heat in the quickest fashion.
•It contains 96% of aluminum, 48mm height and weighs 15g.

•Thermal paste is applied to give mechanical strength to the bond between heat sink and heat source. It eliminates air from the surface area and optimizes the heat transfer between the two contact surfaces.

•Excellent performance in heat dissipation.

Operating Temp.
Can withstand extended temperature from -40°C to 85°C – board level

 

Operating Temp.

 

UT : -40°C to 85°C

 

System

 

CPU

Intel® Atom™ D2550 1.86 GHz

Chipset

Intel® NM10 Express Chipset (Intel® CG82NM10 PCH)

Memory Type

1 x 204-pin SO-DIMM DDR3 800/1066 MHz up to 4GB

BIOS

AMI® BIOS

Super I/O

ITE IT8783F

Watchdog

1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot

 

Mini PCIe

1 x miniPCIe for Gen2

Display

 

Chipset

Integrated Intel® GMA3650 VR Graphic core SGX545

DVI-I

Yes (Max. resolution 1920 x 1200 @ 60 Hz)

LVDS

Supports 18/24-bit single/dual channel LVDS (Max. resolution 1920 x 1080 @ 60Hz)

Dual Independent
Displays Capability

LVDS + DVI-I

Audio

 

Codec

Realtek ALC269 High Definition Audio Codec *2W amplifier onboard

Ethernet

 

Chipset

2 x RTL8111E GbE LAN(support 10/100/1000 Mbps for 2 x RJ45 ports)

WOL

Yes

Boot from LAN

Yes for PXE

Rear I/O

 

DVI-I

1 x 29-pin DVI-I connector (female)

Ethernet

2 x RJ45 ports (support 10/100/1000 Mbps for 2 x RJ45 ports)

COM

1 x RS232/422/485 with 5V/12V selectable

 

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

1 x USB 2.0

Reset Button

1

Internal I/O

 

SATA

1 x SATAII (3 Gb/s)

CF card

1 x CF socket by SATA Gen2 interface

USB

6 x USB 2.0 ports by pin header

COM

4 x COM ports

COM2~COM5 ports support RS232 only with 5V/12V selectable by 1x10-pin header

Audio

1 x 4-pin header for Speak-out

LVDS

30-pin connector

PS/2

2 x 4-pin header

LPT

2 x 13-pin header

DIO

8-bit (4 in/4 out)

OS support list

 

Windows

Windows 7 x32Windows 7 x64

Linux

Fedora 10Fedora 14Fedora 20Open SUSE 12.2Debian 7.0.0Ubuntu 14.04

Mechanical and Environment

 

Form Factor

3.5" SBC

Power Type

12V DC-in, 4-pin ATX power connector, AT/ATX

Dimension

146 x 102 mm (5.7" x 4")

Operating Temp.

UT : -40°C to 85°C

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing

Certification

 

MIL-STD-810G

 

Temperature Shock

MIL-STD-810G Test Method 503.5 Temperature Shock Procedure I-C / Storage (Multi-cycle shocks from constant extreme temperature, Form 85°C to -40°C, Three cycle)

High Temperature

MIL-STD-810G Test Method 501.5 high Temp ( 96 hours @75°C non-operating + 72 hours @ 75°C operating )

Low Temperature

MIL-STD-810G Test Method 502.5 Low Temp ( 96 hours @ -40°C non-operating +72 hours @ -40°C operating )

Test Result

 Device Model  OXY5321A  Test Result  Pass
 Tester  Ian Huang
 Diagram of curves  Test Temperature  Test Time
5321  High  0°C to 70°C  3Hours
 Low  -20°C to 0°C  2Hours
 Test Standard  Reference IEC60068-2
 Test Software  Burnin test v6.0
 Criteria  After testing, system can’t halt.

Test Configuration

 Device  Configuration  Manufacturer  Part Number
 CPU Type  Intel® Atom™ D2550 1.86GHz(10W)  Intel  D2550
 PCH  Intel® NM10 Express Chipset(Intel® CG82NM10 PCH)  Intel  NM10
 Memory  Innodisk 2GB DDR3 1066  Innodisk  
 port2 SATAII  128GB SATA SSD    
 LAN1  Realtek RTL8111E GbE LAN  Realtek  RTL8111E
 LAN2  Realtek RTL8111E GbE LAN  Realtek  RTL8111E
 Test Software  Burnin test v7.1、HD Tune v4.01、iperf、Passmark USB2.0
 Intel TAT 3.8.7.1104,CPU Z-1.67
   
 Chamber  KSON THS-b4t-150 Chipeng SMO-3  KSON Chipeng  THS-b4t-150 SMO-3

 

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5321A for one hour, from 50°C to 70°C.

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OXY5321A_SSD