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Intel® 6th Gen. Skylake-H® Xeon®/Core™ i7 processors & SSD soldering on board, Stackable with StackPC & FPE Expansion, Extended Temperature - 40°C to 85°C

  • Support Intel® Skylake-H Core™ i7-6820EQ Processor
  • Apacer/Smart uSSD 64GB (SATA III)
  • 1 x SO-DIMM up to DDR4-2400 32GB
  • 2 x Mini PCIe (1xhalf size ; 1 x full size)
  • Multi display: 2 x DisplayPort; 1 x DVI-D; Dual Channel 24 Bit LVDS
  • Dual LAN Ports (1 x Intel I210-IT & 1 x I219-LM GbE)
  • 8 x USB ports: 4 x USB 3.0, 4 x USB 2.0
  • Extended operating temp. -40°C to 85°C
  • Technical Profile
  • Specifications
  • CPU
  • SSD Performance



OXY5739A, a powerful rugged EBX SBC is driven by Intel® 6th generation Skylake CPU and chipset soldering onboard. Processor i7-6820EQ plus Intel® QM170 chipset supports clock speed up to 3.5GHz. Quad cores, turbo up to 8 cores, the SBC with high computing power for multi-tasking while reducing idle power consumption. In order to cater various application usages, OXY5739A integrates ample I/O on one board, and also reserve expansion possibility for easy system integration. For mission-critical applications, OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5739A is truly a rugged SBC ideal for defense, military, high-end Automation and heavy-duty railway applications.


Thermal solution for fanless system design

PERFECTRON, expert of truly extended temperature range solution, provide customized thermal kit for motherboard based on evaluation of each motherboard in term of thermal and mechanical design. Heat spreader are used to transfer heat from heat generating point to heat sink and heat sink are used to cool down device’s temperature by dissipating heat into surrounding air. In order to reach best heat dissipation, PERFECTRON customize heat spreader in order to make sure the perfect conduction with key components. Special design heat sink then could have best heat dissipation due to wave line on the interface which increases up to 30-40% air contact area. Combining these two features, thermal performance leverages to utmost, OXY5739A ensures high reliability and stability while working under wide range temperature from -40 up to 85°C


Rich I/O for flexibility in I/O configurations

OXY5739A embraces rich I/O that provides embedded system developers diverse flexibility in I/O configurations to meet different embedded applications. The rich I/O features multiple displays, 2 x DP and DVI-D display connectivity ports with dual channel 24-bit LVDS. OXY5739 reserve also various expansion flexibility, PCIe/104 (StackPC) + FPE for Stackable PCIe/104 module expansion; 1 x Full-size mPCIe/mSATA and 1 x Half-size mPCIe for compact and rugged storage option. This feature-rich board also includes four COM ports, eight USB ports, two Gigabit LANs, two SATAIII, all these can help system integrators to develop solutions quickly.

Stunning resistance of shock and vibration

OXY5739A has key components soldered onboard to eliminate risk of harm caused by vibration. It not only supports Intel CPU onboard but also storage onboard with rugged XR-DIMM RAM option which drastically enhances the resistance of vibration and shock. The stackable expansion slots, FPE (PCIe_16) and StackPC (PCIe/104) enable to expand more functions by adding on extra cards. The cable-free operation remove the concern about loosen cable connections caused by shock & vibration. Combining critical components soldering onboard and solid PCIe/104 connection, OXY5739A is perfect solution for critical application and harsh environment.


Installation Instruction

Procedure: Stick thermal pad on CPU and chipset, and then simply put passive heat sink on thermal pad. Aluminum specially design with two budges on the bottom which are used to contact with CPU and chipset directly to absorb heat efficiently from the bottom layer, and then spread the collected heat to upper aluminum heat sink. Aluminum is known as well heat convection regarding to its metal characteristic. After transferring heat from bottom layer to heat sink, High and low fin design plus wave line create airflow to dissipate heat.



Copper Heat Spreader
The copper heat spreader directly touches heat sources from OXY5739A. •99.9 % purity of copper, weighs 68 g and consumes 87 mm •36 mm height to fulfill the gap between OXY5739A and heat sink enclosure •Nickel plated to prevent corrosion and rust after long-term use •Tailor-made two bulges on heat spreader correspond to the placement of CPU and chipset on OXY5739A


Aluminum Passive Heat Sink

Heat sink is known for lowering the temperature by dissipating heat into the surrounding air.

  • It contains 96 % of aluminum, 40 mm height and weighs 135 g
  • Tailor-made two bulges on the bottom of heat sink correspond to the placement of CPU and PCH on OXY5739A
  • High and low fin design plus wave line increase contact surface up to 30-40% and create airflow.
  • Consume shorter heat dissipating time owing to lower metal density
  • Better performance in heat dissipating


Operating Temp.
Can withstand extended temperature from -40 to 85°C






Operating Temp.


UT : -40°C to 85°C




CPU Type

Intel® Skylake Core™ Processor, BGA type

Intel® Core™ i7-6820EQ Processor (4 x Cores, 8 x Threads,2.80 Ghz Turbo to 3.50 Ghz), 45W


Intel® Skylake QM170 PCH

Memory Type

1 x DDR4 2400 SO-DIMM up to 32 GB w/ECC

NAND Flash

64 GB SATA SSD onboard



Super I/O



1-255 sec. or 1-255 min. software programmable, can generate system reset

Expansion Slot

StackPC + FPE

1 x Half-size mPCIe

1 x Full-size mPCIe/mSATA




Integrated HD Graphics in Skylake-H Processor


2 (Max. resolution 3840 x 2160)


1 (Max. resolution 2048 x 1536)


Dual channel 24-bit LVDS (Max. resolution 1920 x 1080)




Realtek ALC888S High Definition Audio Codec




Intel® I210-IT & I219-LM GbE (support 10/100/1000 Mbps)



Boot from LAN

Yes for PXE

External I/O


Display Port

2 x 20-pin DP connector (female)


1 x 29-pin DVI-D connector (female)


2 x RJ45


1 x RS232/422/485 with 5V/12V selectable

Serial Signals


RS422: TX-, RX+, TX+, RX-, GND



4 x USB 3.0


1 x Mic In, 1 x Line Out

Power Connector

4-pin Terminal Block

Internal I/O


Front Panel


Smart Fan

1 x System Fan

Power Connector

2 (1 x 4-pin/ 2 x 2-pin)


2 x SATAIII (6Gb/s)


4 x USB 2.0 by pin header


3 x COM ports

(1 x RS232 with 5V/12V selectable)

SIM card holder



6 in/2 out with isolation


2 x 15-pin

Mechanical and Environment


Form Factor


Power type

12V DC-in, AT/ATX mode supports with power delay on/off


203 x 146 mm (5.75" x 8")

Operating Temp.

UT : -40 to 85°C

Storage Temp.

-40 to 85°C

Relative Humidity

10% to 90%, non-condensing



MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5 Temperature Shock Procedure I-C / Storage

(Multi-cycle shocks from constant extreme temperature, Form 85 to -40, Three cycle) (Temperature shock)

The OXY5739A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers’ extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

Test Result


Test Configuration

Test Configuration OXY5739A

Thermal Measurement 

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyze the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in OXY5739A- i7-6820EQ for one hour, from +55 to +85°C.